AMD teaming up with Celsia for better passive cooling

In systems where both energy limitations and heat flow are major considerations, passive cooling has been an increasingly popular solution, though not always the best one. Heatsinks are often just not enough to do the job, but as they become more sophisticated they are closing the performance gap with active heat reduction like fans or piping. Celsia has made the heatsink into something more complicated, with water vapor and micro-scale grilles aiding in spreading the heat around faster and better.

AMD is teaming up with these guys to make something nice for its high-end video cards. That’d be another leg up on NVIDIA, as they’ve already pretty much got them beat in price and performance; efficiency and low heat would be icing on the cake.

AMD and Celsia Technologies Collaborate on High Efficiency GPU Cooling Solution

AMD invites Celsia to become part of its technology development project and
present at the 2008 AMD Technical Forum and Exposition

SAN JOSE, Calif., Oct. 20 /PRNewswire-FirstCall/ — Celsia Technologies
(OTC Bulletin Board: CSAT) is partnering with AMD’s graphics product group
on a vapor chamber based cooling solution for high end graphics cards. The
cooling module includes Celsia’s patented NanoSpreader(TM) that
significantly outperforms competing heat pipe based solutions.

“Working with AMD, we were able to meet all of the design criteria for
a new GPU cooler. Namely, it had to be lighter, perform better and be lower
cost than the current heat pipe based design,” said Joe Formichelli,
Celsia’s CEO. “Unlike thermal modules using heat pipes, our two-phase
NanoSpreader comes in direct contact with the heat source whereby removing
costly, heavy base plates.”

As part of AMD’s technology development project, Celsia has been
invited to present at the 2008 AMD Technical Forum and Exposition tomorrow
in Taiwan. Additionally, a short video explaining Celsia’s NanoSpreader
vapor chamber technology will be shown as part of the conference’s opening